Xie, Mayue : rechercher sur Z-Library

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1

Dummy-Based User Location Anonymization Under Real-World Constraints

Hara, Takahiro, Suzuki, Akiyoshi, Iwata, Mayu, Arase, Yuki, Xie, Xing

Journal:

Année:

2016

Langue:

english

Fichier:

PDF, 9.11 MB

english, 2016

2

Bending and buckling of a class of nonlinear fiber composite rods

Alan J. Levy, Akhilesh Shukla, Mayue Xie

Journal:

Journal of the Mechanics and Physics of Solids

Année:

2006

Langue:

english

Fichier:

PDF, 433 KB

english, 2006

3

Defect propagation at a circular interface

Mayue Xie, Alan J. Levy

Journal:

International Journal of Fracture

Année:

2007

Langue:

english

Fichier:

PDF, 717 KB

english, 2007

4

On the Torsion of a Class of Nonlinear Fiber Composite Cylinders

Mayue Xie, Alan J. Levy

Journal:

Journal of Elasticity

Année:

2004

Langue:

english

Fichier:

PDF, 246 KB

english, 2004

5

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes

Kim, Hyunchul, Zhang, Mu, Kumar, Chetan M., Suh, Daewoong, Liu, Pilin, Kim, Dongwook, Xie, Mayue, Wang, Zhiyong

Année:

2007

Langue:

english

Fichier:

PDF, 4.36 MB

english, 2007

6

[ACM Press the 18th SIGSPATIAL International Conference - San Jose, California (2010.11.02-2010.11.05)] Proceedings of the 18th SIGSPATIAL International Conference on Advances in Geographic Information Systems - GIS '10 - A user location anonymization method for location based services in a real environment

Suzuki, Akiyoshi, Iwata, Mayu, Arase, Yuki, Hara, Takahiro, Xie, Xing, Nishio, Shojiro

Année:

2010

Langue:

english

Fichier:

PDF, 830 KB

english, 2010

7

[ACM Press the 8th International Conference - Siem Reap, Cambodia (2014.01.09-2014.01.11)] Proceedings of the 8th International Conference on Ubiquitous Information Management and Communication - ICUIMC '14 - Location anonymization using real car trace data for location based services

Hara, Takahiro, Arase, Yuki, Yamamoto, Ayana, Xie, Xing, Iwata, Mayu, Nishio, Shojiro

Année:

2014

Langue:

english

Fichier:

PDF, 282 KB

english, 2014

8

The Viscoelastic Fiber Composite with Nonlinear Interface

Xie, Mayue, Levy, Alan J.

Journal:

Journal of Applied Mechanics

Année:

2006

Langue:

english

Fichier:

PDF, 234 KB

english, 2006

9

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Innovations in Fault Isolation Methods for 3D Packages with 10X Improvement in Accuracy

Xie, Mayue, Begala, Tom, Kijkanjanapaiboon, Kasemsak, Goyal, Deepak

Année:

2016

Langue:

english

Fichier:

PDF, 798 KB

english, 2016

10

Investigation of Dimensional and Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages

Kijkanjanapaiboon, Kasemsak, Xie, Mayue, Zhou, Jiang, Fan, Xuejun

Journal:

Applied Thermal Engineering

Année:

2016

Langue:

english

Fichier:

PDF, 2.01 MB

english, 2016

11

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Investigation of Geometry, Frequency and Material's Effects in Lock-In Thermography Applications in Semiconductor Packages

Kijkanjanapaiboon, Kasemsak, Xie, Mayue, Fan, Xuejun

Année:

2016

Langue:

english

Fichier:

PDF, 358 KB

english, 2016

12

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Improving Terahertz Signal Travel Distance for Fault Isolation

Devarajulu, Hemachandar Tanukonda, Xie, Mayue, Hu, Chengqing, Goyal, Deepak, Kato, Eiji, Hashimoto, Masaichi

Année:

2017

Langue:

english

Fichier:

PDF, 466 KB

english, 2017

13

Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages

Ravi, Bharath Viswanath, Xie, Mayue, Goyal, Deepak

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2018

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2018

14

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography Applications

Ravi, Bharath Viswanath, Xie, Mayue, Goyal, Deepak

Année:

2018

Fichier:

PDF, 769 KB

2018

15

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography Applications

Ravi, Bharath Viswanath, Xie, Mayue, Goyal, Deepak

Année:

2018

Langue:

english

Fichier:

PDF, 769 KB

english, 2018